Dynatex International is one of the leading companies in the world, which provides wafer and diode die separation products for semiconductor and related industries, providing fabless services, equipment and materials. The company s products include dry process scriber, hoops, frames, carriers, mylar overlays and diamond scribe tools. It provides solutions for separating die or diodes such as dry process dicing, wafer bonding system and wafer dicing system. Dynatex International provides manufacturers with wafer die separation and laser bar cleaving engineering solutions for both traditional wet saw applications and dry process dicing applications. It also offers specialty solvents formulated for particular applications to quickly de-bond adhesives and clean wafers. The various markets served by the company include telecommunications, biotech, aerospace, microelectronics, automotive and lighting.