Founded in 1994, Quik-Pak specializes in microelectronic packaging and advanced assembly services. Products/services offered include open cavity plastic packages, wafer backgrinding or thinning, wafer dicing, die sort/inspection, die attach, gold ball wire bonding, encapsulation, flattening/remolding, marking/branding and custom assembly. It caters to the needs of a wide variety of semiconductor, electronics companies, as well as major military and aerospace institutions. Quik-Pak is an International Traffic in Arms Regulations (ITAR) registered company. It is a division of Delphon Industries, LLC that specializes in providing materials/services for the shipping, processing, printing and packaging of high value technology/medical components.